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Copper wire has been popular in these years when facing ever-increasing gold prices. The success of large scale conversion of gold to copper wire in microelectronics could achieve successfully when all the failure mechanisms that can be discerned during reliability testing. One of these mechanisms is corrosion of the contact between the copper (Cu) ball and the aluminum (Al) bond pad, consisting of...
MIS (Molded Interconnect System) substrate, as a type of coreless substrate, has the advantages of lower profile and higher electrical performance. However, warpage would be one of the major concern without the mechanical support of the core material. In this study, warpage of multilayered MIS substrate has been simulated using finite element analysis (FEA). Coefficients of thermal expansion (CTE)...
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