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Nanoindentation creep tests were conducted on nanocrystalline Cu, Cu–2.3Al and Cu–7.2Al (at.%) alloys at room temperature. The stress exponents were calculated from the loading curves. Results show that the stress exponents are much higher than those in the diffusional creep process, ranging from 5 to 50. The stress exponents increase with the indentation load increasing. However, for Cu–Al alloys,...
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