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Curing epoxies with a mixture of low- and high-Tg diamines has been proposed as a way to increase thermoset toughness. We seek here to understand the origins of toughness enhancement in systems comprised of the diamines poly(oxypropylene)diamine (POPDA) and diethyltoluenediamine (DETDA) together with the epoxy resin diglycidyl ether of bisphenol A (DGEBA) via control of network isomerization. Two...
Encapsulation of solvent during cure is proposed as one way to alter the network topology of crosslinked polymers. We performed all-atom molecular dynamics simulations to study systems comprised of Epon828 epoxy resin and Jeffamine-D400 diamine crosslinkers cured with varying amounts of the inert solvent dichloromethane (0–50 wt%) and then dried and annealed. Densities, glass transition temperatures,...
Interfacial adhesion between a three layer thick graphite nanoplatelet and a vinyl ester (VE) matrix was studied using molecular dynamics simulations. Polymer interphase formation near carbon surfaces influences interfacial bonding and carbon/matrix load transfer. A VE resin was equilibrated near the graphite surfaces and then cured using the Relative Reactivity Volume algorithm to form a crosslinked...
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