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The chip to chip bonding technique using a Cu bump capped with thin Sn layers has been frequently applied to 3D chip stacking technology. We studied the effect of the microstructure on the joints. The joints were fabricated by joining micro-Cu bumps capped with Sn-Ag solder with sizes of 10 mum times 10 mum, 20 mumtimes 20 mum, and 30 mum times 30 mum to Cu pads capped with Sn-Ag solder at 245degC-330...
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