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In nanoscale ductile mode cutting of the monocrystalline silicon wafer, micro/nano groove wear on the diamond cutting tool flank face is often observed, which is beyond the understanding based on conventional cutting processes because the silicon workpiece material is monocrystalline with the hardness lower than that of the diamond cutting tool at room temperature. From the investigation of such a...
In this study, ductile mode cutting of silicon wafer materials has been carried out using an ultra-precision lathe with single crystal diamond cutters and the wear characteristics of the tool and the effect of its different diamond crystal orientations were investigated. Experimental results indicated that wear occurred mainly on the flank face of the tool and the wear pattern was typically mechanical...
Wear in diamond tools is a crucial factor in ultra-precision machining. However, as is well known, single crystal diamond possesses strong anisotropy. Its mechanical and physical properties vary with crystallographic orientation. In this study, tool wear investigation was carried out on nano-scale ductile cutting of silicon using an ultra-precision lathe with single crystal diamond tools. The wear...
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