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This paper presents 3-layer stacked devices in which each wafer is stacked one after another, using 8.18 mum CMOS technology based on 8-inch wafers. Electrical conductivity between each layer was almost 100% and interconnection resistance was less than 0.7Omega between the upper and lower wafers with a Buried Interconnection (BI) and a micro-bump. The prototype devices showed sophisticated functionality...
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