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In this study, the effect of Si content at a welded DSS on the pitting resistance was investigated. Design/methodology/approach: The δ-ferrite fraction increased due to addition of Si, and the amount of γ2 decreased. In the ferric chloride pitting test, the weight reduction range decreased due to an increase in the Si content. As to the location, pittings occurred intensively at the grain boundary...
Cu and Ti films were deposited by sputtering on thermally oxidized Si wafers and then the deposited films were bonded by direct Cu-Cu thermo-compression bonding for evaluating the effect of the wet pre-treatment on the interfacial adhesion energy. The interfacial adhesion energy was evaluated as 0.29, 1.28, 1.64, 1.17, and 0.42 J/m2 by acetic acid pretreatment at 35degC for 0, 1, 5, 10, and 15 min...
This paper presents optimum design of circular membrane for high quality factor. A quality factor of CMUT, we designed for resonant chemical sensor, is dominated by Qair and Qsupport. We investigated these two factors independently. We calculate Qair of circular silicon membrane analytically, and numerically. Calculated Qair is compared to measured value. In order to find Qsupport empirically, we...
We present an improved fabrication method for capacitive micromachined ultrasonic transducers (CMUTs). Recently, a process was developed to fabricate CMUTs using direct wafer-bonding instead of the traditional sacrificial release method. This paper presents a method based on local oxidation of silicon (LOCOS) and direct wafer-bonding to improve the controllability of gap heights and the parasitic...
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