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Ultra shallow junctions are increasingly important to overcome short channel effects, and sub-millisecond annealing offers the ability to control diffusion while simultaneously offering high activation levels. The ultra-fast annealing process needs tight uniformity control to provide consistent device performance across the wafer. The ultratech LSA-100A system features scan pattern overlap flexibility...
The application of laser anneal to semiconductor manufacturing is shown to have advantages and challenges for process control. We discuss some results, the implications of the real-time control mechanism on the ultra-tech anneal tool, the impact of patterning effects and the use of inline data to ensure the tool achieves the target anneal condition.
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