The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In the current study, the effects of deep cryogenic treatment (DCT) on the microstructure and mechanical properties of Sn-3.0Ag-0.5Cu (SAC30) solder joints were investigated. the mechanism of microstructure, tensile strength and fracture path were discussed. The samples were placed in liquid nitrogen environment at 77 K for 24, 72, 168, and 600 hours. The experimental results show that the strength...
Thermal aging effects on the fatigue life of Sn-3.0Ag-0.5Cu (wt%, SAC305) solder joint are investigated. Two series of experiments were conducted: 1) at different temperatures after aging for 72 hours; 2) with different aging time at the cryogenic temperature. The fatigue life of SAC305 solder joint were analyzed statistically by using a modified Weibull distribution model, which takes the thermal...
In the current study, the size effect of Sn3.0Ag0.5Cu solder joints on intermetallic growth is investigated. Experiments were performed to solder joints with a diameter of 2 mm and the solder thickness ranges from 2 mm to 50 µm. The thickness of intermetallic compound (IMC) of solder joints with different thickness as reflowed are found to be dependent on the size of solder joints. The IMC of small...
Tin-zinc solder alloys are considered to be appropriate for soldering of aluminum alloys at low-temperature in electronics and radiators applications. In this paper, the effects of different soldering parameters on the microstructure and interfacial reaction behaviors of 1070Al/Sn-9Zn/1070Al joints were investigated. The results show that the Al substrate was dissolved by the liquid solder, but Al-related...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.