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The evolution of grain structures and microstructures in Cu/Sn–3.5Ag/Cu–xZn (x=0 or 15wt%) TLP bonding before and after aging were investigated. Cu–Sn intermetallic compounds (IMCs) with a strong [001] orientation rapidly form from the Cu pads and cause impingement in TLP bond, allowing cracks to easily propagate. During aging, the Cu6Sn5 becomes one layer with a homogeneous structure, thick Cu3Sn...
In this study, the evolution of grain structures in Cu/Sn–3.5Ag/Cu–xZn (x=0 or 15wt%) microbumps and SAC305/Cu–xZn solder joints was investigated. Due to the small size of microbumps, impingement of interface IMCs easily occur. In a Cu/Sn–3.5Ag/Cu (wt%) microbump, the grain orientation of combined intermetallic compounds (IMCs) tends to be homogenous and closely-grouped, allowing cracks to more easily...
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