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Considering that solder surface may lose its brightness due to oxidation during the assembly and operation of electronic device, this study investigated the surface properties of Sn-Cu-Ni solders using UV-visible and X-ray photoelectron spectroscopies. The degree of discoloring could be evaluated by the reflectance of the sample surface in the visible light range. Two distinct absorption peaks respectively...
This study aimed to investigate the corrosion resistance in 3.5%NaCl solution and high temperature oxidation behavior of Pb-5Sn solder and its alternatives under development, Bi-11Ag and Zn-40Sn. Compared with Pb-5Sn and Zn-40Sn, Bi-11Ag exhibited higher corrosion potential and relatively low corrosion current density. The ductile Ag-rich phase which dispersed in the Bi matrix was able to accommodate...
Suspensions with metallic nanoparticles have been widely used to fabricate conductive lines and electrodes for flexible electronic devices under a relatively low processing temperature. This study prepared thiol-stabilized Au nanoparticle suspension and investigated phase transformation of the Au nanoparticle deposits (NPDs) upon heating via in-situ synchrotron radiation X-ray diffraction. With an...
This study aimed to investigate the electrochemical corrosion behavior of the potential Pb-free solders, Bi-11 wt%Ag and Zn-40 wt%Sn, in 3.5% NaCl solution using the potentiodynamic polarization method with the scanning range from -2000 mV to +2000 mV. Pb-5 wt%Sn alloy was also examined for comparison. Experimental results show that the corrosion potential (Ecorr) decreased in the decreasing order...
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