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Cu-to-Cu direct bonding is one of the key technologies for 3D (three-dimensional) chip stacking. This research proposes a new concept to enhance Cu-Cu direct bonding through the control of residual stresses on bonding surface. Compressive residual stress induced by near-infrared radiation (NIR) enhances the diffusion of copper atoms and thus direct bonding. Subjected to thermal compression bonding...
Eletrochemical corrosion properties of Cu and Ag in the aqueous solutions of reducing agents of formic acid, glycol and ascorbic acid with various concentrations were examined respectively. Experimental results show that there exists no passivation stage on the polarization curves of Cu and Ag in those reductive solutions. Ascorbic acid corrodes Ag faster than the otherss, while formic acid is most...
This study aimed to investigate the corrosion resistance in 3.5%NaCl solution and high temperature oxidation behavior of Pb-5Sn solder and its alternatives under development, Bi-11Ag and Zn-40Sn. Compared with Pb-5Sn and Zn-40Sn, Bi-11Ag exhibited higher corrosion potential and relatively low corrosion current density. The ductile Ag-rich phase which dispersed in the Bi matrix was able to accommodate...
Suspensions with metallic nanoparticles have been widely used to fabricate conductive lines and electrodes for flexible electronic devices under a relatively low processing temperature. This study prepared thiol-stabilized Au nanoparticle suspension and investigated phase transformation of the Au nanoparticle deposits (NPDs) upon heating via in-situ synchrotron radiation X-ray diffraction. With an...
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