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The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu6Sn5. This is a unique phenomenon different from traditional thermal...
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