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The concept of space solar power satellite (SSPS) is an advanced system for collecting solar energy in space and transmitting it wirelessly to earth. However, due to the long service life, in-orbit damage may occur in the structural system of SSPS. Therefore, sensor placement layouts for structural health monitoring should be firstly considered in this concept. In this paper, based on genetic algorithm,...
This study combines finite element (FE) modeling and digital signal processing (DSP) to predict the fatigue life of a ball grid array (BGA) package mounted on the print circuit board (PCB) under a random vibration loading. First, the board-level assembly was modeled using ABAQUS. Then the modal analysis and a following power spectrum analysis were performed to calculate the power spectral density...
This paper presents power loss and thermal analysis of SiC power devices in a 50 kW 3-phase high power density converter during operation. The presented loss and temperature estimations include average analysis and transient analysis by using electro-thermal simulations. For this purpose, thermal impedance network of the SiC power module and cold plate prototype are extracted. Transient analysis shows...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
Knowledge process is the core process in new product development, and is also an organizational learning process which is affected by learning environment. In this paper, an empirical research was conducted to explore the mechanism and paths of the interaction among learning environment, knowledge process and new product development performance. The findings indicate that the learning environment...
This paper presents multi-scale analysis for a MEMS package system with experimental verifications to investigate dynamic responses under drop-shock tests. Dynamic responses such as acceleration waves of MEMS package in macro-scale are measured as the inputs of MEMS structures in micro-scale for numerical simulations. Structural deformation and stress distribution data are extracted and predicted...
A novel pressure microsensor is designed, fabricated and tested. Novel piezoresistive sensing structures using 30- mum thick silicon diaphragms (from 370 mum times 370 mum to 970 mum times 970 mum ) and meander-shaped piezoresistors are devised. The diaphragms in this work thicker than that of the conventional piezoresistive pressure sensors extend the high-stress distribution into the bulk silicon...
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