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The directed self‐assembly of electronic circuits using functional metallic inks has attracted intensive attention because of its high compatibility with extensive applications ranging from soft printed circuits to wearable devices. However, the typical resolution of conventional self‐assembly technologies is not sufficient for practical applications in the rapidly evolving additively manufactured...
In article number 2101754, Wanli Li, Tomonobu Nakayama, Takeo Minari, and co‐workers report an ultrahigh‐resolution directed self‐assembly strategy based on dual surface architectonics (DSA) for high‐performance soft electronics. The DSA endows submicrometer‐scale surface regions with strong adsorbing and pinning effect toward metallic nanoparticle inks via photoirradiation and chemical polarization,...
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