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A tungsten film of 13 μm in thickness was obtained on a copper substrate by galvanostatic electrolysis at 30 mA cm−2 for 40 min in a KF–B2O3–WO3 (67:26:7 mol%) melt at 850 °C. By cross-sectional scanning electron microscopy observation and energy dispersive X-ray analysis, the tungsten layer was found to be compact and free from cracks, voids and melt inclusion. The X-ray diffractometry analysis revealed...
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