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Design techniques for an ultra-thin LSI package embedding a high-pin-count LSI chip in the thin package substrate have been developed to achieve the excellent electrical performance, as well as low warpage and high heat removal. The embedded chip package we designed is 27 mm by 27 mm in size and 0.71 mm in thickness with a heat spreader. The package is attained with only three metal layers against...
METI has launched a national 5-year-project called Humanoid Robotics Project (HRP) since 1998FY. Because humanoid robots have a human-like figure and are able to walk in a biped way and can take an action like a human being, we consider applying the humanoid robot platform in HRP to service fields of caring people such as the elderly, patients, etc. Taking the technical limitation of the current humanoid...
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