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A high-performance DC-DC converter is presented to improve the efficiency and modularity of the vehicular power system. The converter is capable of bidirectional power transfer between the isolated voltage sources. GaN semiconductor switches in the converter turn on and off softly by utilizing the energy stored in the leakage inductance of a transformer. A quasi-resonant operation is also explained...
The wide band-gap (WBG) semiconductor electronics such as silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular in power electronics applications due to their excellent functionality at higher operating temperatures, powers, frequencies and in high radiation environments compared to Si devices. However, the continued drive for higher device and packaging densities has led to extreme...
Strategically controlling heat flow will enable new functionality for future electronics and energy storage systems. Potential performance enhancements include confining and releasing heat in a predetermined fashion, heat flux shielding, or ensuring more isothermal operation. This article experimentally verifies operation of a vapor chamber that exhibits dual heat flux rectification and thermal switch...
Wide band-gap (WBG) power semiconductor devices are being researched in order to meet future high power density electronic packaging targets for a range of power conversion applications. All power devices may be classified based on the current flow direction, namely lateral versus vertical, and for both types, the device junction temperature is determined, in part, by the package thermal resistance...
This extended digest is focused on design for additive manufacturing of next-generation wide band-gap power electronics components, where high operating frequencies, on the order of 100 kHz to 100 MHz, and high volumetric power densities are expected. Common components that enable future WBG power electronics systems, namely high frequency circuit-level magnetics and system-level high performance...
In this article, an approach is explained to controlling the Young's modulus of bonding layers formed using a Transient Liquid Phase (TLP) process. The three focus points of this research include: 1) development of a new bond microstructure for thermal stress mitigation, i.e. Young's modulus reduction, 2) a novel approach to the preparation of bulk specimens for mechanical property tests, and 3) mechanical...
In the current paper, a high-performance cold plate based on single-phase jet impingement and mini-channel heat sink technologies is described for automotive electronics cooling. A manifold system with cylindrical connection tubes and tapered inserts is designed to distribute the coolant uniformly within an individual module and between three different modules. A two-level (local-global) modeling...
Jet impingement cooling with phase change is a technique that has been successfully used to dissipate high heat fluxes (of order of 100 W/cm2 and higher) from advanced electronics. This work reports high speed visualization of jet impingement boiling on a copper heat spreader with porous coating. The coolant used in the experiments is a dielectric fluid, HFE-7100, in combination with a 5 × 5 array...
Under-hood packaging in hybrid vehicles is highly constrained due to smaller vehicle size and additional electric drive components. Moreover, the increased electrification of hybrid vehicles has resulted in a need for greater electrical power handling capability. These two factors have led to larger power densities (in excess of 200 W/cm2) and related thermal management challenges for future hybrid...
This paper is focused on the synthesis and application of optimized jet impingement target surfaces for electronics device cooling. A multiphysics topology optimization method is reviewed along with two-dimensional results for an optimal local jet impingement heat transfer surface. Multiple surface topologies are utilized as building blocks in the development of a three-dimensional cooling structure...
Scanning Hall Probe Microscopy (SHPM) is a quantitative and non-invasive technique for imaging localized surface magnetic field fluctuations such as ferromagnetic domains. In this work, we have eliminated the difficulty in the cantilever-Hall probe integration process, just by gluing a Hall Probe chip to a quartz crystal tuning fork force sensor. The resultant SHPM can operate in variable temperature...
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