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Emerging packages offer diverse options for mounting active and passive devices in a single package, such as side by side, embedded or stacked die placements. These high density packages have increased the cooling issues and are demanding more complex board designs to transfer the heat from the chips to the PCB ground planes. The creation of the most compliant behavioral models to a set of DELPHI...
The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices. The traditional compact representation of IC components that utilises the generation of thermal resistance networks for modelling their complex mechanical structure has been revised to allow the development of new model families for multi-chip...
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