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The reliability of IGBT chip surface electrode for bonding-wires is described. The power cycling (P/C) capability of an IGBT module is improved due to a suppression of chip surface aluminum (Al) electrode degradation with Nickel (Ni) plating. The P/C capability obtained with the Ni plating electrode is about 3 times higher than that with the Al electrode at a high temperature condition. Such a good...
Energy spectra of X-rays emitted from the surface of a fiberglass-reinforced plastic (FRP) insulator were measured at three different positions and compared with those of the vacuum gap between electrodes. Near the anode, the X-ray spectrum was dominated by monoenergetic electrons. Near the cathode, the spectrum peak shifted to low energy as compared with that near the anode. This result showed that...
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