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PET/CT image fusion has emerged as a new and promising research area in recent years, whereas the current standard method for PET/CT fusion, Alpha-blending, often blurs fine anatomical structure. In this paper, a new fusion method based on the Pansharp model is presented. Our proposed method consists of first up-scaling the PET image to the resolution of the CT data by bilinear interpolation and registering...
As copper wire has excellent thermal conductivity, mechanical properties, low-cost advantages and copper stud bump process is similar the traditional wire bonding process, it makes copper stud bump technology better for medium and low I/O devices, and even in the future, it will expand into midrange I/O packages because it offers a large potential savings in packaging costs with the improved performance...
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