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In this work, current stress was applied to investigate electromigration (EM) effects for Cu/Sn/Cu solid-state-diffusion (SSD) bonding in 3D integration. Full-array bumps with different pitches were fabricated on wafers. Asymmetric structure of Cu/Sn bump and Cu bump was deposited by low-cost electroplating process. With optimized surface pretreatment, wafer-level Cu/Sn/Cu SSD bonding was performed...
In this letter, a 3D assembled silicon-embedded transformer (3DASET) is proposed and demonstrated for low-frequency, ultra-high-isolation, compact power transfer applications. The primary and secondary coils of the 3DASET are embedded inside the primary side and secondary side chips, respectively, from the backside to achieve a large coil thickness and a whole-area utilization for each coil, as well...
In this work, Ar mixed 5% H2 plasma was applied to improve the surface properties of electroplated Cu and electroplated Sn for Cu/Sn/Cu solid-state-diffusion (SSD) bonding in 3D interconnection. The surfaces of electroplated Cu and electroplated Sn were easily covered with a thin oxide layer which would reduce the surface activity and degenerate the bonding performance. With an optimal pretreatment...
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