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Ta/Ta2O5 RRAMs show self-compliant characteristics in some Ta or Ta2O5 thickness range but Ti/TaOx RRAMs always need current compliance due to totally consumption of SC conduction layer.
Carbon nanofiber (CNF) is promising as a next-generation on-chip interconnect material. Understanding the temperature dependence of CNF resistance is important in evaluating its potential for such interconnect applications. In a CNF test device, contacts formed by tungsten (W) deposition using focused ion beam (FIB) is effective in minimizing the effect of unwanted parasitics, thus yielding a more...
Microstructural control in thin-layer multilayer ceramic capacitors (MLCC) is one of the present day challenges for maintaining an increase in capacitive volumetric efficiency. It is observed that the continuity of the Ni electrodes increases with increasing heating rate but behaves non-linearly on sintering temperature. It is proposed that an interfacial liquid alloy layer initiates when the Ni electrodes...
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