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Merits of Three-Dimensional (3D) integration offer a technology that meet the requirements of the current trend in many-core processors. However, cost is always the dominant factor of adoption of a new technology. After introduction of a fabrication cost model, 2D, homogeneous 3D and heterogeneous 3D architectures are implemented in eight designs. The fabrication costs of these designs are evaluated...
The convergence of three-dimensional (3D) technology and network-on-chip(NoC), the so-called 3D NoC, bring out new architectures and higher performance than traditional 2D NoCs. However, cost is always the dominant factor of adoption of a new technology. In order to evaluate the economic feasibility of volume production of different architectures of 3D NoCs, we compare the fabrication costs of four...
A simple 2-mask process to realize a two-axis micro scanning mirror is presented. The scanning mirror is made of single-crystal-silicon, and Ni is electroplated at the backside of scanner to induce the magnetostatic driving force.
This study presents two designs to enhance the magnetostatic torque to drive the scanner, (1) the lever arm, and (2) the ferromagnetic material pattern with higher length to width ratio.
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