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This paper reports new device trends of ultra-low power, ultra-low leakage, and ultra-low voltage for IoT applications. The SOTB technology achieves subthreshold leakage as low as 0.2pA/µm. Some device/circuit tricks for non-volatility and ultra-low voltage operation are reviewed.
We demonstrate a cost effective 65-nm SOTB CMOS technology for ultra-low leakage applications. Novel single p+poly-Si/Hf/SiON gate stack of mid-gap work function and precise GIDL control achieved ultra-low leakage of 0.2 pA/µm, which corresponds to approx. 100nA/chip (100k gate logic). Now the SOTB technology can provide three options from ultra-low voltage to ultra-low leakage that covers a wide...
We demonstrate the smallest FinFET SRAM cell size of 0.063 μm2 reported to date using optical lithography. The cell is fabricated with contacted gate pitch (CPP) scaled to 80 nm and fin pitch scaled to 40 nm for the first time using a state-of-the-art 300 mm tool set. A unique patterning scheme featuring double-expose, double-etch (DE2) sidewall image transfer (SIT) process is used for fin formation...
FinFET integration challenges and solutions are discussed for the 22 nm node and beyond. Fin dimension scaling is presented and the importance of the sidewall image transfer (SIT) technique is addressed. Diamond-shaped epi growth for the raised source-drain (RSD) is proposed to improve parasitic resistance (Rpara) degraded by 3-D structure with thin Si-body. The issue of Vt -mismatch is discussed...
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