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The authors have proposed space charge compensation of a low energy ion beam with silicon field emitter arrays to solve the problem of divergence of low energy ion beam for next generation of ion-implantation system. It is required for the electron sources that they do not contain metal to prevent a wafer from contamination. Therefore, as electron sources, a silicon field emitter arrays treated with...
We demonstrated a remarkable breakdown voltage enhancement in a new high-electron-mobility transistor (HEMT) with a wider bandgap AlGaN channel layer. A Si ion implantation doping technique was utilized to achieve sufficiently low resistive source/drain contacts. The obtained maximum breakdown voltage was 1650 V with a gate-drain distance of 10 mum. This result is very promising for the further higher-power...
As the state of the art, ion implantation techniques require high-current ion beams with the lower energy, as the dimension of the devices becomes smaller. However, it is difficult to drive the lower-energy ion beams straightly, due to the huge ionic space charge. We proposed utilization of electron beam emitted from silicon field emitter arrays (Si-FEA) for compensation of the ionic positive space...
Field emitter arrays made of silicon (Si-FEAs) is a possible candidate for the space charge compensation device during ion implantation process for semiconductor devices, because they are free from metal contamination and have less out-gas. When operating in the ion implanter, Si-FEAs suffer from the pressure increase due to out-gassing from resist materials on a silicon wafer. We examined electron...
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