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Both copper (Cu) and silver (Ag) have been studied extensively for electrical conductor applications. To expand the applications, two bonding designs were implemented in this paper. For the first design, a 50-$\mu \text{m}$ Ag layer was annealed at 400 °C to increase Ag grain size, thereby making it more ductile. For the second design, a 5-$\mu \text{m}$ Ag layer with cavities was created to release...
Silver (Ag) solid solution with indium (In) is further studied since Ag-In binary system has been demonstrated with an extraordinary anti-tarnish property and superior mechanical properties, such as malleability, strength, and ductility. How to fabricate that kind of bonding materials at relative low temperatures is a challenge. In this paper, the unique Ag-In solid solution joints are produced successfully...
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