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We have been developing highly radiation-tolerant n + -in-p planar pixel sensors for use in the high-luminosity LHC. Novel n + -in-p structures were made using various combinations of the bias structures (punch-through or polysilicon resistor), isolation structures (p-stop or p-spray), and thicknesses (320μm or 150μm). The 1-chip pixel modules with thin FE-I4 pixel sensors were evaluated...
Liquid encapsulated resin and VPES (Vacuum Printing encapsulation systems) process were developed for SIP included FC and passive component, etc. with solder joint. In the case of RF module, PKG size can be made thin and small in comparison with the metal cap of the conventional technology. However, such module should repeatedly reflow for mounting on the mother board. Otherwise, it will cause the...
Development of foam capsule fabrication for cryogenically cooled fuel targets is overviewed in the present paper. The fabrication development was initiated as a part of the Fast Ignition Realization Experiment (FIREX) project at the ILE, Osaka University in the way of bilateral collaboration between Osaka University and national institute for fusion science (NIFS). For the first stage of FIREX (FIREX-1),...
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