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The effects of zinc-oxide/salt with different contents in the aluminum soldering flux on the interfacial microstructure of Sn-0.7Cu/6061Al and mechanical property of 6061Al/Sn-0.7Cu/6061Al joints were investigated. Results show that the flux containing zinc-oxide and zinc-salt can effectively remove the oxide film on surface of 6061Al and result in formation of corrosion pits at the interface of the...
Low-temperature soldering of 6061Al by an aluminum solder paste consisting of a purpose-designed flux and Sn-0.3Ag-0.7Cu (SAC0307) solder alloy powder with different reflow process parameters (such as the heating rate, peak soldering temperature and joint thickness) and the reliability of the soldered joints were investigated in this study. With increasing the heating rate, the spreading performance...
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