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Modern microelectronics and emerging technologies such as wearable electronics and soft robotics require elastomers to integrate high damping with low thermal resistance to avoid damage caused by vibrations and heat accumulation. However, the strong coupling between storage modulus and loss factor makes it generally challenging to simultaneously increase both thermal conductance and damping. Here,...
Elastomers are regarded as one of the best candidates for the matrix material of soft electronics, yet they are susceptible to fracture due to the inevitable flaws generated during applications. Introducing microstructures, sacrificial bonds, and sliding cross‐linking has been recognized as an effective way to improve the flaw insensitivity rate (Rinsen). However, these elastomers still prone to failure...
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