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In this paper, a recently developed high resolution electron diffraction technique is employed to characterize the grain orientation and grain boundaries for 45 nm node Cu interconnects with SiCN capping. The results are applied to evaluate the grain structure effect on electromigration (EM) reliability. We first calculate the flux divergence for void formation using interfacial and grain boundary...
A recently developed precession electron diffraction (PED) technique in transmission electron microscopy (TEM) was employed to characterize the grain orientation and grain boundaries for Cu interconnects of the 45 nm node. The results showed a strong <111gt; and <110gt; textures along the width and the thickness of the line, respectively and a low fraction of coherent twin boundaries...
Digital image forensics seeks to detect statistical traces left by image acquisition or post-processing in order to establish an images source and authenticity. Digital cameras acquire an image with one sensor overlayed with a color filter array (CFA), capturing at each spatial location one sample from the three necessary color channels. The missing pixels must be interpolated in a process known as...
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