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In nanoscale ductile mode cutting of the monocrystalline silicon wafer, micro/nano groove wear on the diamond cutting tool flank face is often observed, which is beyond the understanding based on conventional cutting processes because the silicon workpiece material is monocrystalline with the hardness lower than that of the diamond cutting tool at room temperature. From the investigation of such a...
Nanoscale ductile mode cutting of single crystalline silicon is a very promising technology for fracture free machining of silicon wafers. In the technology, the tool edge radius is required to on nanoscale for the ductile chip formation mode. Therefore, one of the main concerns with the implementation of such a technology is the tool wear and its effect on chip formation mode. In this study, the...
Wear in diamond tools is a crucial factor in ultra-precision machining. However, as is well known, single crystal diamond possesses strong anisotropy. Its mechanical and physical properties vary with crystallographic orientation. In this study, tool wear investigation was carried out on nano-scale ductile cutting of silicon using an ultra-precision lathe with single crystal diamond tools. The wear...
In this paper, an experimental investigation on the tool wear characteristics in ductile cutting of tungsten carbide using commercially available cubic boron nitride (CBN) inserts is presented. The experiments were carried out on a high-speed milling machine tool (Makino V55). The cutting forces were measured using a three-component dynamometer. The tool wear was examined using an optical measurement...
Metal matrix composites (MMCs) have been found to possess tremendous prospective engineering applications that require materials offering a combination of lightweight with considerably enhanced mechanical and physical properties. However, the applications of MMCs are limited by their poor machinability which is a result of their highly abrasive nature that causes excessive wear to the cutting tools...
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