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Through Silicon Via (TSV) has emerged as a good solution to provide high density interconnections in three-dimensional packaging interconnect technologies. However, the thermal-mechanical reliability is a big issue. When the TSV is subjected to thermal load, large stress and strain would be created at the interface of the materials because of the great mismatch of CTE. In this paper, an axi-symmetric...
Strain gage measurement is widely used in electronic industry as an effective tool for assessing and controlling risk levels. However, the accuracy of strain gage measurement is easily influenced by many factors, among which sampling rate/scan frequency setting of a measure equipment remains an important one. Some critical strain values may be missed if the sampling rate is too low, on the contrary,...
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling loading during transportation, handling, and usage. Various underfills are widely used in the electronics industry to deal with these challenges, however, the above approaches have some intrinsic shortcomings such as high material costs, low manufacturing assembly rate,...
Due to the differences in the thermal expansion coefficients of copper and silicon, a large thermal stress develops at the interface between a Cu-filled via and both the insulation layer and the surrounding silicon when the structure is subjected to temperature loading. In this paper four TSV geometries are considered in an effort to investigate the role of via geometry on stress relief. Thermo-mechanical...
This paper describes the design of a tri-axial microelectromechanical force sensor (FS) that can be mounted on the tip of the guidewire. Piezoresistive silicon nanowires (SiNW) are embedded into a cross cantilever design with a manoeuvrable stylus to allow the detection of force in all directions. The electrical resistance changes in the four SiNWs are used to decode an arbitrary force applied onto...
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