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We report realization of a THz camera based on electro-optical detection of THz radiation from an optical parametric oscillator, using a silicon-based CCD camera as the optical detector. The dynamic range of 16.5 dB for a 6000-frame average (2-minute data acquisition time) is limited by laser noise.
The through silicon via (TSV) process developed by Silex provides down to 30 mum pitch for through wafer connections in up to 600 mum thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true ldquoWafer Level Packagingrdquo - features that are particularly important in consumer market applications. The TSV technology also enables integration of advanced interconnect...
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