The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, the effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution has been investigated. Additive W weight content of Ni-W alloy ranged from 16 to 18 at. %. Controlled thickness of barrier layer was prepared on Cu substrate. Then, excessive matte Sn electroplated on as-deposited Ni-W layer. Ni-W had compact microstructure in state of FCC solid solution, which means it had good...
Transmission Electron Microscopy (TEM), as a main analysis technique, together with Scanning Electron Spectroscopy (SEM) and Energy Dispersive X-ray Spectroscopy (EDX) were employed to analyze the morphology and microstructure of Au-Al interface of Gold ball bonding. A special sample preparation method for TEM analysis was devised to overcome peeling issue of Gold bonding ball from the Al pad. There...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.