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High junction temperature is always a big concern for the LED products since it is generally associated with the product's reliability. Therefore, the way to maintain an adequate cooling capacity is extremely important for LED module. It is no doubt that thermal resistance is one of critical indicators restricting the heat dissipation. In this work, one LED module with ceramic carrier is submitted...
It is very crucial to guarantee a lower junction temperature effectively for the application of Light Emitting Diode (LED) products, and also extremely useful to obtain the junction temperature accurately. In this paper, a predicted method for junction temperature of LED lamp is proposed. Numerical stimulation combined with experimental validation is carried out to evaluate the junction temperature...
The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry...
High junction temperature is always a big concern for the LED products since it is generally associated with the product's reliability. Therefore, the way to maintain an adequate cooling capacity is extremely important for LED module. It is no doubt that thermal resistance is one of critical indicators restricting the heat dissipation. In this work, one LED module with ceramic carrier is submitted...
It is very crucial to guarantee a lower junction temperature effectively for the application of Light Emitting Diode (LED) products, and also extremely useful to obtain the junction temperature accurately. In this paper, a predicted method for junction temperature of LED lamp is proposed. Numerical stimulation combined with experimental validation is carried out to evaluate the junction temperature...
The study focus on the process of metal electroplating on copper substrate to assemble LED chips and molding PET-copper foil to implement a flexible module with LED chips. The process can be divided into two parts,-assembling process and molding process. The LEDs are integrated on copper foil which can deal with the heat dissipation problem effectively. The metal electroplating on copper circuitry...
In this paper, some models of LED luminaires with drive power supply were established by Pro/Engineer. The temperature distribution of these models was obtained by ANSYS Workbench. And the influences of the location of drive power supply and surface areas of heat sinks were discussed. When drive power supply was located in different groove, the temperature of drive power supply was gradually reduced...
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