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How to fabricate conductive patterns on ceramic boards with higher resolution is a challenge in the past years. The fabrication of copper patterns on alumina substrate by laser direct writing and electroless copper plating is a low cost and high efficiency method. Nevertheless, the lower resolution limits its further industrial applications in many fields. In this report, the mechanisms of laser direct...
Adhesion strength is a crucial factor for the performance and reliability of metallic patterns on insulator substrates. In this study, we present an efficient technique for selective metallization of alumina ceramic with high adhesion strength by using nanosecond laser modification and electroless copper plating. Specifically, a 355nm Nd:YVO4 ultraviolet (UV) laser was employed not only to decompose...
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