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In this paper, the recent advances in low temperature process in view of 3D VLSI integration are reviewed. Thanks to the optimization of each low temperature process modules (dopant activation, gate stack, epitaxy, spacer deposition) and silicide stability improvement, the top layer thermal budget fabrication has been decreased in order to satisfy the requirements for 3D VLSI integration.
A general framework is proposed to characterize digital library gates for NBTI and HCI ageing effects. Required parameters extraction is demonstrated for practical cases using accurate, state-of-the-art reliability simulation flow. Both NBTI recovery and HCI models are required to accurately assess digital product degradation.
Channel hot-carrier degradation presents a renewed interest in the last NMOS nodes where the device reliability of bulk silicon (core) 40 nm and Input/Output (IO) device is difficult to achieve at high temperature as a function of supply voltage VDD and back bias VBS. A three mode interface trap generation is proposed based on the energy acquisition involved in distinct interactions in all the VGS...
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