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This paper presents a novel technique and algorithm for chip-scale electromigration (EM) aware 3D placement. A simple TSV's EM objective function is used, providing a computationally efficient way to represent TSV EM other than the finite-element-method (FEM) based simulation. Considering TSV's EM is mutually influenced by neighboring TSVs (due to TSV EM's dependence on TSV-induced thermal mechanical...
3D-ICs bring about new challenges to chip thermal management due to their high heat densities. Micro-channel based liquid cooling and thermal through-silicon-vias (TSVs) have been adopted to alleviate the thermal issues in 3D-ICs. Thermal TSV (which have no electrical significance), enables higher interlayer thermal conductivity thereby achieving a more uniform thermal profile. While somewhat effective...
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with micro-channels. This approach, though might provide sufficient cooling, requires quite high pumping power. In this paper, we investigate the non-uniform allocation of micro-channels to provide sufficient cooling with less...
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