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This paper presents an 8.69 Mvertices/s, 278 Mpixels/s, 15.7 mm2 tiled-based 3D graphics SoC HW/SW supporting OpenGL ES 1.0 running at 139 MHz. The SoC also includes embedded circuitry to monitor run time characteristics, detect bus protocol error/inefficiency, and capture bus traces at various abstraction levels with compression ratio up to 98%.
A tiled-based 3D graphics IP is designed to support OpenGL ES 1.0. The test chip runs at 139 MHz and achieves 8.69 Mvertices/s and 278 Mpixels/s with its die size as 15.7 mm2. The IP includes embedded circuitry to monitor run time 3DG characteristics, detect bus protocol error and inefficiency, and capture bus trace at various abstraction levels with compression ratio up to 98%.
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