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This paper uses a single-layer LIDAR system mounted on a pan-tilt unit to obtain multi-layer information. A calibration method for extending the single-layer information to multi-layer information is proposed. In order to obtain multi-layer information from single-layer LIDAR, the LIDAR system has to tilt the scanning plane at various angles and integrate those scanning planes to construct a three-dimensional...
In this study, the design, fabrication, and calibration of the piezoresistive stress sensors [1–18] embedded in a TSV (through silicon via) interposer in a 300mm wafer are investigated. The results presented herein should be useful for the development of 3D integration such as measuring the strength of the TSV device and interposer wafers, during and after all the processes such as wafer thinning,...
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