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The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
The failure of solder joints on Cu-Fe-P lead frame of power MOSFETs was found after long term services. The microstructures of failed and accelerated experimental solder joints have been investigated in detail in order to find out the failure mechanism. SEM, TEM, EDS and EPMA techniques were used in this study. Observed results showed that all failed MOSFETs had worked in the higher current while...
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