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The crystal growth, morphology and structure of the intermetallic compounds (IMCs) at the Sn–9Zn–xAg/Cu interface have been investigated. During isothermal aging, the local strain and crystallite size of the IMCs vary with aging time due to the growth and decomposition of the IMCs. The Kirkendall voids form at the Sn–9Zn/Cu interface after aging at 180°C for 250h but are not observed at the Sn–9Zn–xAg/Cu...
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