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The authors provide a new modeling approach for the simulation of thermo-electro-mechanical stress effects within PCBs (printed circuit boards) and electronic packages. Difficult design challenges created by these effects occur throughout the full range of the product lifecycle, from the concept phase when determining a device's footprint to the analysis of reliability failures encountered after manufacturing...
We compared the geometrical efficiencies and parallax errors of three different conceptual dedicated brain PETs, including a spherical cap design (R=18cm), a dodecahedron design (inscribed sphere radius = 15cm) and a cylindrical design (30cm in height and 30 cm in diameter) with their conventional whole body counterpart (a cylinder 20cm in height and 76 cm in diameter) by calculating the Solid Angle...
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