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We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied...
This paper describes the design, manufacture and measure of tactile sensor with piezoresistive detection of deflection. The tactile sensor array was constructed with a fully integrated complementary metal oxide semiconductor (CMOS) fabrication process and bulk micromachining for the sensing structures. Electrical connections were made between the flexible printed circuit boards (FPCB) and the sensor...
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