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The impact of strain-induced oxide trap charge on the performance and reliability of fully silicided (FUSI)-metal-gate silicon-on-insulator (SOI) MOSFETs is investigated. High strain from a contact etch stop layer (CESL) in FUSI-gate transistors increases channel mobility and drain current driving. A CESL nMOSFET with a thick SOI demonstrates increased hot-electron degradation than its thin SOI counterpart...
An RF power MOSFET was proposed and manufactured in a standard 0.13 μm CMOS technology. Without adding additional masks, cost and process, the breakdown voltage can be improved by using the N-well and shallow-trench-isolation processes to form a drift n- region. The breakdown voltage was 4.3 V at gate bias of 1.2 V. The cutoff frequency and maximum oscillation frequency were 68 GHz and 87 GHz, respectively...
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