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This paper is devoted to the capacitance computing and characterization of interconnection crossing and patch used in multilevel package. The [C] matrix calculation is performed with scalar potential given in its integral form. Analytical formulas easy to use in CAD systems have been derived from numerical results using least square method. A good agreement has been achieved between simulations and...
This study investigates the computing of the inductance of the tape automated bonding (TAB), The [L] matrix calculation is performed with the potential vector given in an integral form, taking into account the current density distribution on the conductors. The partial element equivalent circuit method (PEEC) is used for this calculation. Analytical formula easy to use in CAD is derived from the numerical...
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