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The paper deals with the manipulation of silicon microcomponents in order to assembly automatically. The size of the components vary from 600 mum times 400 mum times 100 mum to 300 mum times 300 mum times 100 mum with a notch of 100 mum thickness on every side. The microassembly process is split up into elementary tasks (aligning component, positioning component, centering component, opening gripper,...
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