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3D system-in-package has recently been considered a major enabler for high density and heterogeneous microsystem integration. We hereby proposed the concept of a unified micromachining and packaging platform based on LTCC (low temperature cofired ceramic) material system and process, which is implemented by first enhancing an existing LTCC hybrid IC fabrication line and then integrating different...
This paper reports the designing, simulation and initial experimental investigation into a LTCC vacuum microsystem package substrate acting both as a vital panel and a functional structure for compact system-in-package (SiP) integration. Design, validation and experimental results for microchannels with different planar axial shapes are presented. Experimental and simulated temperature distribution...
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