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A silicon (Si) platform, which consists of passive alignment structures (V-grooves), active microelectromechanical systems (MEMS) alignment components, mechanical locking mechanisms, and predeposited gold-tin soldering pads is developed to address the submicron accuracy assembly requirement of the discrete laser diode (LD) to a small core in-chip Si waveguide (WG). A 2-D in situ active alignment of...
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